The repair bond strength to resin matrix in cured resin composites after water aging.

The repair microshear bond strengths (microSBSs) to resin matrices in 4 different cured-composites after water storage (0, 60 s, 1 week, 1 month) were evaluated. Three different adhesive application methods to the cured-composites were performed; (1) none, (2) onestep self-etch adhesive application, and (3) one-step self-etch adhesive application with a silane coupling agent. Degree of conversion (DC) of the composite discs was determined using ATR/FT-IR with a time-based spectrum analysis. Initially, the amount of un-reacted resin monomers in the repaired cured-composite contributed to the bonding performance of newly-filled uncured-composite to resin matrix of the cured-composite. Adhesive application could not improve their repair microSBS. After 1-month of water-storage, the repair microSBS was dependent on material, which either reduced or did not and was not influenced by their amount of un-reacted resin monomers. When repairing aged composite resin, the appropriate adhesive application procedures were different among resin composites.