Effects of the conventional, soft start, and pulse delay modes produced by light-emitting diode device on metal brackets bond strength and enamel damage: An in vitro comparative study.

OBJECTIVES: This study aimed to compare the bond strength and enamel damage following debonding of metal brackets cured by different light-curing modes: conventional, soft start, and pulse delay modes. MATERIAL AND METHODS: Sixty extracted upper premolars were randomly divided into three groups according to the used light-curing mode. Metal brackets were bonded with a light-emitting diode device employing different modes. Group 1: conventional mode (10s mesial+10 s distal); group 2: soft start mode (15s mesial+15s distal); group 3: pulse delay mode (3s mesial+3s distal, followed by 3min of no photoactivation, then 9s mesial+9s distal). Radiant exposure was the same in all study groups. Shear bond strengths of the brackets were tested with a universal testing machine. A stereomicroscope was used to determine the number and length of enamel microcracks. One-Way ANOVA and Kruskal-Wallis tests were used to detect significant differences in shear bond strength and microcracks number and length among groups. RESULTS: The soft start and pulse delay modes produced significantly greater shear bond strength than the conventional mode (19.46+/-4.90MPa; 20.47+/-4.97MPa; 12.14+/-3.79MPa, respectively, P<0.001). However, there was no significant difference between the soft start and pulse delay groups (P=0.768). The number and length of microcracks increased significantly after debonding in all study groups. The change in microcracks length was not different among study groups. CONCLUSION: The soft start and pulse delay modes produced greater bond strength than the conventional mode without predisposing enamel to higher risk of damage. Conservative methods for debonding are still required.